SMALL-SIZED DEVICE MAINTENANCE MECHANISM
PROBLEM TO BE SOLVED: To provide a film deposition apparatus suitable for deposition of an extremely small wafer such as a half-inch size, capable of improving maintainability in a chamber; and to provide a processing unit for a minimal fabrication system.SOLUTION: A film deposition apparatus includ...
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Format | Patent |
Language | English Japanese |
Published |
20.06.2016
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Abstract | PROBLEM TO BE SOLVED: To provide a film deposition apparatus suitable for deposition of an extremely small wafer such as a half-inch size, capable of improving maintainability in a chamber; and to provide a processing unit for a minimal fabrication system.SOLUTION: A film deposition apparatus includes a sputtering source 31, a chamber 34 provided oppositely to the sputtering source 31, and a drawing body 35 mounted drawably from the chamber 34, and has a constitution in which the drawing body 35 has a deposition prevention plate for covering at least a part of the inside of the chamber 34 in the mounted state in the chamber 34.SELECTED DRAWING: Figure 3
【課題】ハーフインチサイズのようなきわめて小さいウェハの成膜に適し、チャンバ内のメンテナンス性が向上する成膜装置および、ミニマルファブシステム用処理装置を提供する。【解決手段】本発明は、スパッタ源31と、スパッタ源31に対向して設けたチャンバ34と、チャンバ34から引き出し可能に取り付けた引き出し体35と、を具備し、引き出し体35は、チャンバ34内に取り付けた状態で、チャンバ34内の少なくとも一部を覆う防着板を有した構成である。【選択図】図3 |
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AbstractList | PROBLEM TO BE SOLVED: To provide a film deposition apparatus suitable for deposition of an extremely small wafer such as a half-inch size, capable of improving maintainability in a chamber; and to provide a processing unit for a minimal fabrication system.SOLUTION: A film deposition apparatus includes a sputtering source 31, a chamber 34 provided oppositely to the sputtering source 31, and a drawing body 35 mounted drawably from the chamber 34, and has a constitution in which the drawing body 35 has a deposition prevention plate for covering at least a part of the inside of the chamber 34 in the mounted state in the chamber 34.SELECTED DRAWING: Figure 3
【課題】ハーフインチサイズのようなきわめて小さいウェハの成膜に適し、チャンバ内のメンテナンス性が向上する成膜装置および、ミニマルファブシステム用処理装置を提供する。【解決手段】本発明は、スパッタ源31と、スパッタ源31に対向して設けたチャンバ34と、チャンバ34から引き出し可能に取り付けた引き出し体35と、を具備し、引き出し体35は、チャンバ34内に取り付けた状態で、チャンバ34内の少なくとも一部を覆う防着板を有した構成である。【選択図】図3 |
Author | OGISO HISATO KAMEI RYUICHIRO YABUTA YUKI HARA SHIRO SUN YU KATO AKIHIKO WU ZHENG-QING MIZUGUCHI HISASHI NAKANO ZEN |
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DocumentTitleAlternate | 小型装置保守機構 |
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Snippet | PROBLEM TO BE SOLVED: To provide a film deposition apparatus suitable for deposition of an extremely small wafer such as a half-inch size, capable of improving... |
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SubjectTerms | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
Title | SMALL-SIZED DEVICE MAINTENANCE MECHANISM |
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