SMALL-SIZED DEVICE MAINTENANCE MECHANISM

PROBLEM TO BE SOLVED: To provide a film deposition apparatus suitable for deposition of an extremely small wafer such as a half-inch size, capable of improving maintainability in a chamber; and to provide a processing unit for a minimal fabrication system.SOLUTION: A film deposition apparatus includ...

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Main Authors OGISO HISATO, KAMEI RYUICHIRO, SUN YU, NAKANO ZEN, YABUTA YUKI, MIZUGUCHI HISASHI, HARA SHIRO, KATO AKIHIKO, WU ZHENG-QING
Format Patent
LanguageEnglish
Japanese
Published 20.06.2016
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Abstract PROBLEM TO BE SOLVED: To provide a film deposition apparatus suitable for deposition of an extremely small wafer such as a half-inch size, capable of improving maintainability in a chamber; and to provide a processing unit for a minimal fabrication system.SOLUTION: A film deposition apparatus includes a sputtering source 31, a chamber 34 provided oppositely to the sputtering source 31, and a drawing body 35 mounted drawably from the chamber 34, and has a constitution in which the drawing body 35 has a deposition prevention plate for covering at least a part of the inside of the chamber 34 in the mounted state in the chamber 34.SELECTED DRAWING: Figure 3 【課題】ハーフインチサイズのようなきわめて小さいウェハの成膜に適し、チャンバ内のメンテナンス性が向上する成膜装置および、ミニマルファブシステム用処理装置を提供する。【解決手段】本発明は、スパッタ源31と、スパッタ源31に対向して設けたチャンバ34と、チャンバ34から引き出し可能に取り付けた引き出し体35と、を具備し、引き出し体35は、チャンバ34内に取り付けた状態で、チャンバ34内の少なくとも一部を覆う防着板を有した構成である。【選択図】図3
AbstractList PROBLEM TO BE SOLVED: To provide a film deposition apparatus suitable for deposition of an extremely small wafer such as a half-inch size, capable of improving maintainability in a chamber; and to provide a processing unit for a minimal fabrication system.SOLUTION: A film deposition apparatus includes a sputtering source 31, a chamber 34 provided oppositely to the sputtering source 31, and a drawing body 35 mounted drawably from the chamber 34, and has a constitution in which the drawing body 35 has a deposition prevention plate for covering at least a part of the inside of the chamber 34 in the mounted state in the chamber 34.SELECTED DRAWING: Figure 3 【課題】ハーフインチサイズのようなきわめて小さいウェハの成膜に適し、チャンバ内のメンテナンス性が向上する成膜装置および、ミニマルファブシステム用処理装置を提供する。【解決手段】本発明は、スパッタ源31と、スパッタ源31に対向して設けたチャンバ34と、チャンバ34から引き出し可能に取り付けた引き出し体35と、を具備し、引き出し体35は、チャンバ34内に取り付けた状態で、チャンバ34内の少なくとも一部を覆う防着板を有した構成である。【選択図】図3
Author OGISO HISATO
KAMEI RYUICHIRO
YABUTA YUKI
HARA SHIRO
SUN YU
KATO AKIHIKO
WU ZHENG-QING
MIZUGUCHI HISASHI
NAKANO ZEN
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– fullname: MIZUGUCHI HISASHI
– fullname: HARA SHIRO
– fullname: KATO AKIHIKO
– fullname: WU ZHENG-QING
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Snippet PROBLEM TO BE SOLVED: To provide a film deposition apparatus suitable for deposition of an extremely small wafer such as a half-inch size, capable of improving...
SourceID epo
SourceType Open Access Repository
SubjectTerms CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Title SMALL-SIZED DEVICE MAINTENANCE MECHANISM
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