VEHICULAR LIGHTING FIXTURE

PROBLEM TO BE SOLVED: To reduce influence of heat on a semiconductor light-emitting element in lighting of the semiconductor light-emitting element, and ensure an excellent lighting state of the semiconductor light-emitting element.SOLUTION: A vehicular lighting fixture includes: a substrate 13 on o...

Full description

Saved in:
Bibliographic Details
Main Authors KAJIYAMA KAZUKI, ISHIKAWA TOMOZO
Format Patent
LanguageEnglish
Japanese
Published 09.06.2016
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:PROBLEM TO BE SOLVED: To reduce influence of heat on a semiconductor light-emitting element in lighting of the semiconductor light-emitting element, and ensure an excellent lighting state of the semiconductor light-emitting element.SOLUTION: A vehicular lighting fixture includes: a substrate 13 on one surface of which a first semiconductor light-emitting element 23 and a lighting control component 24 are installed, and on the other surface of which a second semiconductor light-emitting element 25 is installed; and a holding member 10 for holding the substrate. The first semiconductor light-emitting element and the second semiconductor light-emitting element are installed at different positions in a direction orthogonal to the thickness direction of the substrate. The lighting control component is arranged at a position different from the position at which the holding member exists. Consequently, influence of heat on the semiconductor light-emitting element in lighting of the semiconductor light-emitting element is reduced, and an excellent lighting state of the semiconductor light-emitting element can be ensured.SELECTED DRAWING: Figure 2 【課題】 半導体発光素子の点灯時における半導体発光素子に対する熱の影響を低減し、半導体発光素子の良好な点灯状態を確保する。【解決手段】 一方の面に第1の半導体発光素子23と点灯制御部品24が搭載され他方の面に第2の半導体発光素子25が搭載された基板13と、基板を保持する保持部材10とを備え、第1の半導体発光素子と第2の半導体発光素子が基板の厚み方向に直交する方向において異なる位置に搭載され、点灯制御部品が保持部材の存在する位置とは異なる位置に配置された。これにより半導体発光素子の点灯時における半導体発光素子に対する熱の影響が低減され、半導体発光素子の良好な点灯状態を確保することができる。【選択図】図2
Bibliography:Application Number: JP20140243322