MANUFACTURING METHOD OF CONDUCTIVE FILM ROLL

• Main Authors: TAKAO HIROYUKI, ISHIBASHI KUNIAKI, FUJINO NOZOMI
• Format: Patent
• Language: English; Japanese
• Published: 09.06.2016
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a manufacturing method of a conductive film roll, which can maintain a high quality without fitting adjacent films to each other by pressure.SOLUTION: In a manufacturing method according to the invention, a long-sized film base material is transported, and a first laminate is formed by sputtering a first transparent conductive layer, a first metal layer, and a first metal oxide coating film layer composed of an oxide of metal constituting the first metal layer in order on a first surface side not contacting a first film deposition roll of the film base material. Then, the film base material on which the first laminate is formed is transported, and a second laminate is formed by sputtering a second transparent conductive layer, a second metal layer, and a second metal oxide coating film layer in order on a second surface side of the film base material on which the first laminate is not formed. Then, the film base material on which the first and second laminates are formed is wound in a roll state.SELECTED DRAWING: Figure 1 【課題】隣接するフィルム同士が圧着されずに高品質を維持することができる導電性フィルムロールの製造方法を提供する。【解決手段】本発明の製造方法は、長尺状のフィルム基材を搬送し、フィルム基材の該第１成膜ロールと接触していない第１面側に、第１透明導電体層と、第１金属層と、前記第１金属層を構成する金属の酸化物からなる第１酸化金属皮膜層とを、スパッタ法により順次積層して第１積層体を形成する。次に、第１積層体が形成されたフィルム基材を搬送し、該フィルム基材の上記第１積層体が形成されていない第２面側に、第２透明導電体層と、第２金属層と、第２酸化金属被膜層とを、スパッタ法により順次積層して第２積層体を形成する。そして、第１及び第２積層体が形成されたフィルム基材をロール状に巻回する。【選択図】図１