METHOD OF MANUFACTURING PLATE-LIKE MEMBER WITH BUMP ELECTRODE, PLATE-LIKE MEMBER WITH BUMP ELECTRODE, METHOD OF MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT

• Main Authors: OKADA HIROKAZU, MATSUO MAKOTO, URAGAMI HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 02.06.2016
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PERFORMING OPERATIONS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a method of manufacturing a plate-like member with a bump electrode, which enables simple and efficient manufacture of an electronic component having both a via electrode (the bump electrode) and the plate-like member.SOLUTION: A method of manufacturing a plate-like member with a bump electrode is a method of manufacturing a member for an electronic component having a chip sealed with a resin. The member is the plate-like member 10 with the bump electrode, which has the bump electrode 12 fixed on the one side of the plate-like member 10. The method of manufacturing the plate-like member with the bump electrode includes a molding step of concurrently molding the plate-like member 10 and the bump electrode 11 by molding using a molding tool.SELECTED DRAWING: Figure 5 【課題】 ビア電極（突起電極）及び板状部材の両方を有する電子部品を簡便かつ効率的に製造できる突起電極付き板状部材の製造方法を提供する。【解決手段】 本発明の突起電極付き板状部材の製造方法は、チップを樹脂封止した電子部品用の部材の製造方法であって、前記部材は、板状部材１１の片面に突起電極１２が固定された突起電極付き板状部材１０であり、成形型を用いた成形により、板状部材１０と突起電極１１とを同時に成形する成形工程を含むことを特徴とする。【選択図】図５