ELECTRONIC MODULE AND CAMERA MODULE

PROBLEM TO BE SOLVED: To provide an electronic module which can achieve thickness while securing rigidity.SOLUTION: According to one embodiment, an electronic module includes: a substrate having a first region and a second region; an imaging device disposed in the first region; mold resin disposed i...

Full description

Saved in:
Bibliographic Details
Main Authors SUZUKI DAIGO, LIN FONGRU, HAPPOYA AKIHIKO, OTSUBO ATSUSHI
Format Patent
LanguageEnglish
Japanese
Published 30.05.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide an electronic module which can achieve thickness while securing rigidity.SOLUTION: According to one embodiment, an electronic module includes: a substrate having a first region and a second region; an imaging device disposed in the first region; mold resin disposed in the first region and for covering a peripheral end part of the imaging device; and a terminal part disposed on a surface of the second region.SELECTED DRAWING: Figure 4 【課題】剛性を確保しつつ、薄型化を図ることができる電子モジュールを提供する。【解決手段】一つの実施形態によれば、電子モジュールは、第１領域と第２領域とを有した基板と、前記第１領域に設けられた撮像素子と、前記第１領域に設けられ、前記撮像素子の周端部を覆うモールド樹脂と、前記第２領域の表面に設けられた端子部とを備える。【選択図】図４
Bibliography:Application Number: JP20140238881