PEELABLE METAL FOIL AND MANUFACTURING METHOD OF THE SAME, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD

• Main Authors: WAKAO IWAO, ODA MASAHITO, SAKITSU MIMA, ARAI TOSHIYUKI
• Format: Patent
• Language: English; Japanese
• Published: 30.05.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To prevent a peelable metal foil from being peeled due to stress in a manufacturing process of a printed circuit board to improve manufacturing yield of the printed circuit board.SOLUTION: A manufacturing method of a printed circuit board comprises the steps of: manufacturing a multilayer substrate by layering an insulating resin layers and a peelable metal foil in which a plurality of through holes are formed on an outer periphery of the peelable metal foil and a plurality of metal layers are layered with peelable intermediate layers being sandwiched among the metal layers one by one for making the plurality of metal layers be peelable by the intermediate layers and a plurality of through holes are formed adjacent to each other on an outer periphery of the peelable metal foil; cutting off a peripheral part of the multilayer substrate by machine work; and subsequently peeing the peelable metal foils to manufacture the printed circuit board.SELECTED DRAWING: Figure 1 【課題】印刷配線板の製造工程におけるストレスにより製造途中にピーラブル金属箔が剥離することを防止し、印刷配線板の製造歩留まりを向上させる。【解決手段】複数の金属層の間に剥離可能な中間層を挟んで積層されて前記中間層により前記複数の金属層が剥離可能にされたピーラブル金属箔の外周部に複数の互いに隣接した貫通孔が形成されているピーラブル金属箔と絶縁樹脂層を積層して積層基板を製造し、その積層基板の周縁部を機械加工により切り離し、次にピーラブル金属箔を剥離して印刷配線板を製造する。【選択図】図１