ACTIVE ENERGY RAY-CURABLE ADHESIVE COMPOSITION
PROBLEM TO BE SOLVED: To provide an active energy ray-curable adhesive composition excellent in adhesive power, transparency and curing property and hardly generating wave even adhering a thin film at large area.SOLUTION: There is provided an active energy ray-curable adhesive composition containing...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
30.05.2016
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide an active energy ray-curable adhesive composition excellent in adhesive power, transparency and curing property and hardly generating wave even adhering a thin film at large area.SOLUTION: There is provided an active energy ray-curable adhesive composition containing following (A) component of 1 to 50 wt.%, following (B) component of 1 to 98 wt.% and following(C) component of 1 to 98 wt.% based on a whole composition. (A) component: a polymer obtained by adding hydrogen after polymerizing a vinyl monomer at a temperature of 150 to 350°C. (B) component: a compound having an ethylenically unsaturated group. (C) component: a compound having 2 ethylenically unsaturated group.SELECTED DRAWING: None
【課題】接着力、透明性及び硬化性に優れ、薄いフィルムを大面積で接着してもうねりを発生させない活性エネルギー線硬化型接着剤組成物の提供。【解決手段】組成物全体に対して、下記(A)成分を1〜50重量%、下記(B)成分を1〜98重量%及び下記(C)成分を1〜98重量%の割合で含む活性エネルギー線硬化型接着剤組成物。(A)成分:ビニル系単量体を150〜350℃の温度で重合した後、水素を付加することにより得られる重合体(B)成分:1個のエチレン性不飽和基を有する化合物(C)成分:2個のエチレン性不飽和基を有する化合物【選択図】なし |
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Bibliography: | Application Number: JP20140236103 |