BUS BAR CIRCUIT BODY AND METHOD OF MANUFACTURING THE SAME

• Main Authors: AKIMOTO NAOYA, OGA YUYA, NOZAKI TAKESHI
• Format: Patent
• Language: English; Japanese
• Published: 26.05.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a bus bar circuit body having a new structure, capable of positioning and fixing a large number of bus bars to a resin substrate with excellent work efficiency, and also to provide a method of manufacturing the same.SOLUTION: A bus bar circuit body includes: a plurality of bus bars 16 respectively having a conductive path forming part 18; and a resin substrate 14 in which the conductive path forming parts 18 of the plurality of bus bars 16 are molded in a buried state. In the resin substrate 14, a pair of through-holes 32, 32 are provided in which a coupling part 60 for coupling the conductive path forming parts 18 of neighboring arranged bus bars 16 to each other is exposed to upper and lower surfaces 20, 30. The coupling part 60 exposed from the pair of through-holes 32, 32 is made to be cut.SELECTED DRAWING: Figure 6 【課題】優れた作業効率で多数のバスバーを樹脂基板に対して位置決め固定することができる、新規な構造のバスバー回路体およびその製造方法を提供すること。【解決手段】導電路形成部１８をそれぞれ有する複数のバスバー１６と、複数のバスバー１６の導電路形成部１８が埋設状態でモールド成形された樹脂基板１４とを備え、樹脂基板１４には、隣接配置されたバスバー１６の導電路形成部１８を相互に連結する連結部６０を上下面２０，３０に露呈させる一対の貫通孔３２，３２が設けられており、一対の貫通孔３２，３２から露呈された連結部６０が切断されているようにした。【選択図】図６