SOLDERING DEVICE AND COMPONENT SOLDERING METHOD USING THE SAME

• Main Author: AWAJI DAISUKE
• Format: Patent
• Language: English; Japanese
• Published: 26.05.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a soldering device which properly performs soldering even when a component is held by a movable arm, and to provide a component soldering method using the soldering device.SOLUTION: A soldering device 1 solders a component PA held by a movable arm 10 to a circuit board CS and includes: a heater 40 on which the circuit board CS is disposed; and spray ports 43 provided in portions of the heater 40, which exclude a predetermined arrangement portion in which the circuit board CS should be disposed, the spray ports 43 being configured to spray a reducing gas.SELECTED DRAWING: Figure 1 【課題】 可動アームによって部品が保持された状態であっても、適切にはんだ付けを行うことができるはんだ付け、および、それを用いた部品のはんだ付け方法を提供する。【解決手段】 可動アーム１０に保持された部品ＰＡと回路基板ＣＳとをはんだ付けするはんだ付け装置１であって、回路基板ＣＳが配置されるヒーター４０と、当該ヒーター４０において回路基板ＣＳが配置されるべき所定の配置部位以外の部位に設けられ、還元性ガスが噴霧される噴霧口４３とを備えることを特徴とする。【選択図】 図１