POLISHING COMPOSITION AND METHOD FOR PRODUCING SUBSTRATE USING THE SAME

• Main Authors: OKADA YASUNORI, SUGIYAMA HIROYASU, AKIYAMA TOMOMI
• Format: Patent
• Language: English; Japanese
• Published: 26.05.2016
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DRESSING OR CONDITIONING OF ABRADING SURFACES; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PERFORMING OPERATIONS; POLISHES; POLISHING; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SEMICONDUCTOR DEVICES; SKI WAXES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a polishing composition which can polish a polishing object having a crystalline metal compound on its surface with higher polishing efficiency.SOLUTION: A polishing composition is used for polishing a polishing object having a crystalline metal compound on its surface, and comprises aluminum oxide abrasive grains, colloidal silica abrasive grains, and water.SELECTED DRAWING: None 【課題】表面に結晶性の金属化合物を有する研磨対象物を、より高い研磨能率で研磨することができる研磨用組成物を提供する。【解決手段】表面に結晶性の金属化合物を有する研磨対象物を研磨する用途で使用される研磨用組成物であって、酸化アルミニウム砥粒、コロイダルシリカ砥粒、および水を含む、研磨用組成物。【選択図】なし