ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

• Main Authors: TAKAHASHI MASARU, FUJII CHIYOUICHIROU
• Format: Patent
• Language: English; Japanese
• Published: 23.05.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide an electronic component embedded substrate in which, even if distortion due to voltage application occurs in an electronic component embedded in a resin layer, the vibration thereof is reduced and furthermore the generation of audible sound due to the vibration is prevented or reduced, and a manufacturing method of the electronic component embedded substrate.SOLUTION: An electronic component embedded substrate 1 includes a core substrate B, an electronic component 10 mounted on one main surface of the core substrate B by a joining member S, and a resin layer R provided to embed the electronic component 10. The electronic component 10 is a laminated ceramic capacitor including: a ceramic laminate 11; a first external electrode 12 having an end face part TP12 provided on an end face of the ceramic laminate 11; and a second external electrode 13 having an end face part TP13. A first gap G1 is formed between the resin layer R, and the end face part TP12 of the first external electrode 12 and the joining member S, and a second gap G2 is formed between the resin layer R, and the end face part TP13 of the second external electrode 13 and the joining member S.SELECTED DRAWING: Figure 2 【課題】樹脂層に埋設されている電子部品に電圧の印加による歪みが発生したとしても、その振動が低減され、さらに振動による可聴音の発生が防止または低減された電子部品内蔵基板およびその製造方法を提供する。【解決手段】電子部品内蔵基板１は、コア基板Ｂと、コア基板Ｂの一方主面に接合部材Ｓにより実装された電子部品１０と、電子部品１０を埋設して設けられた樹脂層Ｒとを備える。電子部品１０は、セラミック積層体１１と、セラミック積層体１１の端面上に設けられる端面部ＴＰ１２を有する第１の外部電極１２および端面部ＴＰ１３を有する第２の外部電極１３と、を備える積層セラミックコンデンサである。樹脂層Ｒと、第１の外部電極１２の端面部ＴＰ１２および接合部材Ｓとの間に第１の隙間Ｇ１が形成されており、第２の外部電極１３の端面部ＴＰ１３および接合部材Ｓとの間に、第２の隙間Ｇ２が形成されている。【選択図】図２