DISPLAY DEVICE AND MANUFACTURE METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a display device in which a top face of a partition wall is formed planar or protrusive by preventing the top face of the partition wall from being deformed and recessed in a manufacture process.SOLUTION: A display device 1 comprises: a substrate 11; a first lower el...

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Bibliographic Details
Main Author NENDAI KENICHI
Format Patent
LanguageEnglish
Japanese
Published 23.05.2016
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Summary:PROBLEM TO BE SOLVED: To provide a display device in which a top face of a partition wall is formed planar or protrusive by preventing the top face of the partition wall from being deformed and recessed in a manufacture process.SOLUTION: A display device 1 comprises: a substrate 11; a first lower electrode 21 and a second lower electrode 22 which are provided while interposing a gap 25 therebetween; a first partition wall 41 that is formed from a resin material; a first organic functional layer 71 and a second organic functional layer 72; and an upper electrode 82. A bottom face 41a of the first partition wall 41 includes a first portion 41a1 and a second portion 41a2. A height from the first portion 41a1 to the second portion 41a2 of the bottom face 41a of the first partition wall 41 is 30% or less with respect to a height from the first portion 41a1 of the bottom face 41a of the first partition wall 41 to a highest point 41b2 of a top face 41b of the first partition wall 41. A width of the second portion 41a2 of the bottom face 41a of the first partition wall 41 is 20% or less with respect to a width of the first partition wall 41.SELECTED DRAWING: Figure 1 【課題】製造過程において隔壁の上面が変形して凹形状になることを防止することで、隔壁の上面が平面形状または凸形状である表示装置を提供する。【解決手段】表示装置1は、基板11と、隙間25を空けて設けられた第1下部電極21および第2下部電極22と、樹脂材料で構成された第1隔壁41と、第1有機機能層71および第2有機機能層72と、上部電極82と、を備える。第1隔壁41の底面41aは、第1部分41a1と、第2部分41a2とを有する。第1隔壁41の底面41aの第1部分41a1から第2部分41a2までの高さは、第1隔壁41の底面41aの第1部分41a1から第1隔壁41の上面41bの最高点41b2までの高さに対して、30%以下である。第1隔壁41の底面41aの第2部分41a2の幅は、第1隔壁41の幅に対して、それぞれ20%以下である。【選択図】図1
Bibliography:Application Number: JP20140228164