LIQUID JET HEAD, AND LIQUID JET DEVICE
PROBLEM TO BE SOLVED: To suppress stress caused by contraction of a filler for covering wiring of a wiring board.SOLUTION: A liquid jet head 30 includes: a diaphragm 36 on which a piezoelectric element 38 for jetting ink is arranged; a sealing plate 44 which is arranged on an arrangement surface 362...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
19.05.2016
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To suppress stress caused by contraction of a filler for covering wiring of a wiring board.SOLUTION: A liquid jet head 30 includes: a diaphragm 36 on which a piezoelectric element 38 for jetting ink is arranged; a sealing plate 44 which is arranged on an arrangement surface 362 of the diaphragm 36 and covers the piezoelectric element 38; a wiring board 50 which has a first surface 521 with wiring 54 for supplying a drive signal to the piezoelectric element 38 formed and a second surface 522 opposite to the first surface 521, and in which the first surface 521 of a first end part 52A is bonded to the arrangement surface 362 of the diaphragm 36; and a filler 60 which is formed at least between a wall surface 446 of the sealing plate 44 and the first surface 521 and covers the wiring 54. A height of the filler 60 to the arrangement surface 362 is higher on a first surface 521 side as compared with a second surface 522 side.SELECTED DRAWING: Figure 5
【課題】配線基板の配線を覆う充填材の収縮に起因した応力を抑制する。【解決手段】液体噴射ヘッド30は、インクを噴射するための圧電素子38が設置された振動板36と、振動板36の設置面362に設置されて圧電素子38を覆う封止板44と、圧電素子38に駆動信号を供給する配線54が形成された第1面521と第1面521の反対側の第2面522とを含み、第1端部52Aの第1面521が振動板36の設置面362に接合された配線基板50と、封止板44の壁面446と第1面521との間に少なくとも形成されて配線54を覆う充填材60とを具備し、設置面362に対する充填材60の高さは、第2面522側と比較して第1面521側のほうが高い。【選択図】図5 |
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Bibliography: | Application Number: JP20140218559 |