PRODUCTION METHOD OF MOLD, MOLD, PRODUCTION METHOD OF FILM, AND FILM

• Main Authors: YAMADA NAOKO, KOSHITOUGE HARUKI
• Format: Patent
• Language: English; Japanese
• Published: 16.05.2016
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; GENERAL PROCESSES OF COMPOUNDING; HOLOGRAPHY; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

PROBLEM TO BE SOLVED: To provide a production method for obtaining a mold with fewer defects, by which aggregates in a resist liquid can be efficiently removed.SOLUTION: A production method of a mold is provided, including the following steps: step A of settling aggregates in a resist liquid by centrifugal force; step B of collecting a supernatant of the resist liquid obtained in step A in which the aggregates are settled; step C of filtering the supernatant obtained in step B to obtain a purified resist liquid; step D of applying the purified resist liquid obtained in step C to a surface of a mold base material; and step E of forming a pattern on the surface of the mold base material by etching.SELECTED DRAWING: None 【課題】レジスト液中の凝集物を効率的に取り除くことができ、欠陥の少ない金型を得るための製造方法を提供する。【解決手段】以下の工程を順次含む金型の製造方法。工程Ａ：遠心力によりレジスト液中の凝集物を沈降させる工程。工程Ｂ：工程Ａで得られた凝集物が沈降したレジスト液の上澄み液を採取する工程。工程Ｃ：工程Ｂで得られた上澄み液を濾過して精製したレジスト液を得る工程。工程Ｄ：工程Ｃで得られた精製したレジスト液を金型母材の表面に塗布する工程。工程Ｅ：エッチングにより金型母材の表面にパターンを形成する工程。【選択図】なし