COATING TYPE COMPOSITION FOR FORMING BPSG FILM, SUBSTRATE, AND METHOD FOR FORMING PATTERN

PROBLEM TO BE SOLVED: To provide a coating-type composition for forming a BPSG film excellent in adhesion in a fine pattern, capable of wet-etching easily with a stripping liquid which does not damage a coating type organic film necessary for a semiconductor substrate and a patterning process, and a...

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Bibliographic Details
Main Authors KIKUCHI RIE, TANEDA YOSHINORI, OGIWARA TSUTOMU, TACHIBANA SEIICHIRO
Format Patent
LanguageEnglish
Japanese
Published 12.05.2016
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Summary:PROBLEM TO BE SOLVED: To provide a coating-type composition for forming a BPSG film excellent in adhesion in a fine pattern, capable of wet-etching easily with a stripping liquid which does not damage a coating type organic film necessary for a semiconductor substrate and a patterning process, and a CVD film composed mainly of carbon, capable of maintaining releasability even after dry etching, and further capable of suppressing the generation of particles as forming by a coating process.SOLUTION: The coating-type composition for forming BPSG film includes: a compound having not less than one of structures composed of silicone as a skeleton represented by the formulae (1), not less than one of structures composed of phosphoric acid as a skeleton, not less than one of structures composed of boric acid as a skeleton, not less than one of structures composed of silicone as a skeleton, and a silicon-silicon bond.SELECTED DRAWING: None 【課題】微細パターンにおける密着性に優れ、半導体基板やパターニング工程で必要な塗布型有機膜や炭素を主成分とするCVD膜に対してダメージを与えない剥離液で容易にウエットエッチング可能であり、また、ドライエッチング後も剥離性を維持でき、さらに塗布プロセスで形成することでパーティクルの発生を抑制できるBPSG膜を形成するための塗布型BPSG膜形成用組成物を提供する。【解決手段】式(1)で示されるケイ酸を骨格とする構造のうち1種類以上,リン酸を骨格とする構造のうち1種類以上,ホウ酸を骨格とする構造のうち1種類以上,及びケイ素を骨格とする構造のうち1種類以上を有し,かつケイ素−ケイ素連結を有する化合物を含む塗布型BPSG膜形成用組成物。【選択図】なし
Bibliography:Application Number: JP20140204545