POLYARYLENE SULFIDE FILM

PROBLEM TO BE SOLVED: To provide a polyarylene sulfide film having excellent adhesion to metal and/or resin molding, excellent quality (improved thickness unevenness) as a film, and excellent heat shrinkage properties.SOLUTION: A polyarylene sulfide film has a melting point of 260-275°C and a thickn...

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Bibliographic Details
Main Authors TANAKA TAKASHI, HIGASHIOJI TAKUJI, WAKAHARA YOKO
Format Patent
LanguageEnglish
Japanese
Published 09.05.2016
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
GENERAL PROCESSES OF COMPOUNDING
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a polyarylene sulfide film having excellent adhesion to metal and/or resin molding, excellent quality (improved thickness unevenness) as a film, and excellent heat shrinkage properties.SOLUTION: A polyarylene sulfide film has a melting point of 260-275°C and a thickness unevenness of 0.01-10%.SELECTED DRAWING: None 【課題】 金属および／または樹脂成形体との接着性およびフィルムとしての品位（厚み斑）、熱収縮特性に優れたポリアリーレンスルフィドフィルムを提供すること。【解決手段】 融点が２６０〜２７５℃であり、厚み斑が０．０１〜１０％であることを特徴とするポリアリーレンスルフィドフィルム。【選択図】 なし
Bibliography:Application Number: JP20140198076