LIGHT EMISSION MODULE

• Main Author: SHIBUSAWA SOICHI
• Format: Patent
• Language: English; Japanese
• Published: 28.04.2016
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; LIGHTING; MECHANICAL ENGINEERING; NON-PORTABLE LIGHTING DEVICES; SEMICONDUCTOR DEVICES; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS; WEAPONS

PROBLEM TO BE SOLVED: To provide a light emission module in which the width of a substrate can be reduced.SOLUTION: A light emission module has a substrate, plural mounting portions arranged on the substrate so as to stand in a line, and plural semiconductor light emission elements each of which is provided to each of the mounting portions. The plural mounting portions contain one or more first mounting portions each of which has a wiring portion provided with the semiconductor light emission element, a first separation portion disposed away from the wiring portion in a predetermined direction intersecting to the arrangement direction of the plural mounting portions, and a second separation portion disposed so as to sandwich the wiring portion between the second separation portion and the first separation portion, and one or more second mounting portions each of which has a wiring portion, a second separation portion disposed in the predetermined direction and a first separation portion disposed so as to sandwich the wiring portion between the first separation portion and the second separation portion, the first mounting portions and the second mounting portions being alternately arranged on the substrate. In each semiconductor light emission element, an anode electrode is connected to the first separation portion, and a cathode electrode is connected to the second separation portion. The wiring portions are electrically connected to one another in parallel by connection members disposed between the plural separation portions and the plural wiring portions provided with the semiconductor light emission elements.SELECTED DRAWING: Figure 7 【課題】基板の幅を細くすること。【解決手段】実施形態に係る発光モジュールは、基板と、基板に一列に並んで配置される複数の実装部と、実装部の各々に設けられる複数の半導体発光素子と、を具備し、複数の実装部は、半導体発光素子が設けられる配線部、複数の実装部が並ぶ方向と交差する所定の方向に配線部と離間して配置される第１の離間部、及び、第１の離間部との間で配線部を挟む位置に配置される第２の離間部を有する１以上の第１の実装部と、配線部、所定の方向に配置される第２の離間部、及び、第２の離間部との間で配線部を挟む位置に配置される第１の離間部を有する１以上の第２の実装部とが交互に基板に配置され、各半導体発光素子は、アノード電極が第１の離間部と接続され、カソード電極が第２の離間部と接続され、配線部は、複数の離間部と、半導体発光素子が設けられる複数の配線部との間に配置された接続部材によって並列に電気接続される。【選択図】図７