SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSING METHOD

• Main Authors: GOSHI GENTARO, SUGANO ITARU, KONO HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 25.04.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a substrate liquid processing apparatus which enables improvement of the in-plane uniformity of substrate processing, and to provide a substrate liquid processing method.SOLUTION: A substrate liquid processing apparatus according to an embodiment includes: a holding section; a rotary mechanism; a liquid supply section; and a gas supply section. The holding section holds a substrate. The rotary mechanism rotates the holding section. The liquid supply section supplies a process liquid to a center part of one surface of the substrate held by the holding section. The gas supply section supplies a gas having a temperature lower than a temperature of the process liquid to a center part of the other surface of the substrate held by the holding section.SELECTED DRAWING: Figure 3 【課題】基板処理の面内均一性を向上させることのできる基板液処理装置および基板液処理方法を提供すること。【解決手段】実施形態に係る基板液処理装置は、保持部と、回転機構と、液供給部と、気体供給部とを備える。保持部は、基板を保持する。回転機構は、保持部を回転させる。液供給部は、保持部に保持された基板の一方の面の中心部に対して処理液を供給する。気体供給部は、保持部に保持された基板の他方の面の中心部に対し、処理液の温度未満の気体を供給する。【選択図】図３