METHOD OF FORMING THIN FILM PIEZOELECTRIC ELEMENT, PIEZOELECTRIC ACTUATOR, MICROPUMP, DROPLET DISCHARGE HEAD, INK CARTRIDGE, AND IMAGE FORMATION DEVICE

• Main Author: NISHIMURA MANABU
• Format: Patent
• Language: English; Japanese
• Published: 21.04.2016
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CORRECTION OF TYPOGRAPHICAL ERRORS; ELECTRICITY; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; PERFORMING OPERATIONS; PRINTING; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SELECTIVE PRINTING MECHANISMS; SPRAYING OR ATOMISING IN GENERAL; STAMPS; TRANSPORTING; TYPEWRITERS

PROBLEM TO BE SOLVED: To prevent thinning (edge bead) of a thin film piezoelectric element at the outer peripheral edge of a wafer, and occurrence of crack caused by uneven thickness of the edge, by a simple method when forming a thin film piezoelectric element by a spin coating method.SOLUTION: A PZT film 143 is formed on a wafer 10 by repeating a process for applying a sol-gel solution forming the PZT film 143 on a lower electrode 141, while rotating the wafer 10 on which a diaphragm 123 and the lower electrode 141 are formed, and calcining after application of the sol-gel solution. A step for removing the sol-gel solution thus applied by scattering a rinse liquid 14 to the outer peripheral edge 10a of the wafer 10 is included before ending application of a thin film formation agent to the outer peripheral edge 10a of the wafer 10.SELECTED DRAWING: Figure 1 【課題】スピンコート法による薄膜圧電素子の形成に際し、ウエハーの外周縁部での薄膜圧電素子の厚膜化（エッジビード）、およびエッジ部の膜厚ムラに起因するクラックの発生を、簡単な方法で防止する【解決手段】振動板１２３、および下部電極１４１を重ねて形成したウエハー１０を回転させつつ、下部電極１４１にＰＺＴ膜１４３を形成するゾルゲル液を塗布し、ゾルゲル液の塗布後において焼成する工程を繰り返して、ウエハー１０にＰＺＴ膜１４３を形成する。ウエハー１０の外周縁部１０ａへの薄膜形成剤の塗布が終了する前に、外周縁部１０ａにリンス液１４を散布して塗布したゾルゲル液を除去する工程を含む。【選択図】図１