ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

• Main Authors: SAKUYAMA SEIKI, SHIMIZU KOZO
• Format: Patent
• Language: English; Japanese
• Published: 21.04.2016
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To achieve an electronic device excellent in bonding reliability between electronic components.SOLUTION: An electronic device 1 includes an electronic component 10 having a terminal 11, an electronic component 20 having a terminal 21 facing the terminal 11, and a bonding part 30 for bonding these terminals 11, 21. The bonding part 30 contains a planar compound 31 elongating from the terminal 11 to the terminal 21, or from the terminal 21 to the terminal 11. Since the planar compound 31 is contained, strength of the bonding part 30 is enhanced. The planar compound 31 is formed by cooling and solidifying the bonding material, in a state where one of the electronic component 10 and the electronic component 20 has a higher temperature than the other, when bonding the terminals 11, 21 by using a bonding material.SELECTED DRAWING: Figure 1 【課題】電子部品間の接合信頼性に優れる電子装置を実現する。【解決手段】電子装置１は、端子１１を備える電子部品１０と、その端子１１に対向する端子２１を備える電子部品２０と、それらの端子１１と端子２１を接合する接合部３０とを含む。接合部３０は、端子１１から端子２１或いは端子２１から端子１１に向かう方向に延びる板状の化合物３１を含有する。板状の化合物３１が含有されることで、接合部３０の強度の向上が図られる。板状の化合物３１は、接合材を用いて端子１１と端子２１を接合する際に、電子部品１０と電子部品２０のうちの一方を他方よりも高温にした状態で、接合材を冷却し凝固させることで形成される。【選択図】図１