POLYAMIDE RESIN COMPOSITION

• Main Authors: AKITA DAI, NAKAGAWA YASUSHI, UMEZU HIDEYUKI
• Format: Patent
• Language: English; Japanese
• Published: 21.04.2016
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a polyamide resin composition that has an excellent thermal conductivity, flowability and melt retention stability during injection molding, and that can provide a molded article having an excellent mechanical strength.SOLUTION: There is provided the polyamide resin composition which is obtained by blending (A) 25 to 45 pts.wt. of polyamide resin, (B) 25 to 74 pts.wt. of magnesium hydroxide and (C) 1 to 40 pts.wt. of glass fiber relative to the total of 100 pts.wt. of (A) and (B) and (C) and which satisfies all of the following (I) to (III). (I) The thermal conductivity measured by a heat flow meter method is 0.8 W/m-K or more. (II) The melt viscosity at 1216 secafter 5 minutes melt retention at a melting point + 35°C is 20 to 200 Pa-s. (III) B/A is 0.7 to 1.2, where A denotes the melt viscosity at 1216 secafter 5 minutes melt retention at melting point + 35°C and B denotes the melt viscosity at 1216 secafter 30 minutes melt retention at melting point + 35°C.SELECTED DRAWING: None 【課題】熱伝導率、射出成形時の流動性および溶融滞留安定性に優れ、機械強度に優れた成形品を得ることのできるポリアミド樹脂組成物を提供すること。【解決手段】（Ａ）と（Ｂ）と（Ｃ）の合計１００重量部に対し、（Ａ）ポリアミド樹脂２５〜４５重量部、（Ｂ）水酸化マグネシウム２５〜７４重量部および（Ｃ）ガラス繊維１〜４０重量部を配合してなり、下記（Ｉ）〜（ＩＩＩ）の全てを満足することを特徴とするポリアミド樹脂組成物。（Ｉ）熱流計法で測定した熱伝導率が０．８Ｗ／ｍ・Ｋ以上。（ＩＩ）融点＋３５℃で５分間溶融滞留させた後の１２１６ｓｅｃ−１における溶融粘度が２０〜２００Ｐａ・ｓ。（ＩＩＩ）融点＋３５℃で５分間溶融滞留させた後の１２１６ｓｅｃ−１における溶融粘度をＡ、融点＋３５℃で３０分間溶融滞留させた後の１２１６ｓｅｃ−１における溶融粘度をＢとしたとき、Ｂ／Ａが０．７〜１．２。【選択図】なし