LIGHT-EMITTING MODULE

• Main Authors: KAMIMURA KOZO, SHIBUSAWA SOICHI
• Format: Patent
• Language: English; Japanese
• Published: 14.04.2016
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEATING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED; LIGHTING; MECHANICAL ENGINEERING; SEMICONDUCTOR DEVICES; WEAPONS

PROBLEM TO BE SOLVED: To prevent a power supply pad from being exposed.SOLUTION: A light-emitting module according to an embodiment includes a substrate, a mounting pad, a semiconductor light-emitting element, a power supply pad, a wire, and a sealing member. The mounting pad is provided on the substrate. The semiconductor light-emitting element is provided on the mounting pad. The power supply pad is provided on the substrate so that an outer edge of the same is positioned on a virtual line of a circle contacting an outer edge of the mounting pad or inside the virtual line. The wire connects the semiconductor light-emitting element and power supply pad. The sealing member is provided on the substrate so as to cover the mounting pad, power supply pad, semiconductor light-emitting element, and wire.SELECTED DRAWING: Figure 6 【課題】給電パッドの露出を防ぐこと。【解決手段】実施形態に係る発光モジュールは、基板と、実装パッドと、半導体発光素子と、給電パッドと、ワイヤと、封止部材と、を具備する。実装パッドは、基板上に設けられる。半導体発光素子は、実装パッド上に設けられる。給電パッドは、実装パッドの外縁と接する円の仮想線上または仮想線よりも内側に外端が位置するように基板上に設けられる。ワイヤは、半導体発光素子と給電パッドとを接続する。封止部材は、実装パッド、給電パッド、半導体発光素子およびワイヤを覆うように基板上に設けられる。【選択図】図６