PACKAGE OF ELECTRIC ELEMENT

PROBLEM TO BE SOLVED: To provide a package of an electric element which enables reduction of the size and thickness of the package, reduction of power consumption and displacement caused by temperature regulation of the package, stably conducts optical input/output in between the interior and exteri...

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Main Authors JIN YOSHITO, EBISAWA FUMIHIRO, HASHIMOTO ETSU, YAMAGUCHI JOJI, SATO NORIO, SUZUKI MASAYA
Format Patent
LanguageEnglish
Japanese
Published 11.04.2016
Subjects
BASIC ELECTRIC ELEMENTS
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FREQUENCY-CHANGING
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Summary:PROBLEM TO BE SOLVED: To provide a package of an electric element which enables reduction of the size and thickness of the package, reduction of power consumption and displacement caused by temperature regulation of the package, stably conducts optical input/output in between the interior and exterior of the package with high reliability, and needs the temperature regulation.SOLUTION: In a package, a chip carrier 107 incorporates a heater 109 that is a temperature regulating element and is integrally held with an electric element 103 in a fixing manner. Out of the electric element 103 and the chip carrier 107, only the electric element 103 is fixed to an inner surface of a package container 100 through a fixing part 120. The structure allows a large portion of heat generated by the heater 109 to be effectively provided for temperature regulation of the electric element 103 and thereby significantly reduces leakage of the heat to the package container 100 or an exterior part of the container 100.SELECTED DRAWING: Figure 1 【課題】パッケージをより小型化および薄型化し、より消費電力を減らし、さらに、パッケージの温度調整に伴う位置ずれを減らして、パッケージの内外間における光学的な入出力を安定して信頼性高く行える、温度調整が必要な電気素子のパッケージを提供する。【解決手段】パッケージ１００において、チップキャリア１０７は温度調節素子であるヒータ１０９を内蔵しており、電気素子１０３と一体に固定保持される。電気素子１０３およびチップキャリア１０７は、電気素子１０３のみが固定部１２０を介してパッケージ容器１００の内面に固定される。この構成によって、ヒータ１０９から生成される熱は大部分が電気素子１０３の温度調整のために効率的に与えられ、パッケージの容器１００や容器の外部への熱の漏れを大幅に抑えることができる。【選択図】図１
Bibliography:Application Number: JP20140175585