MULTILAYER WIRING BOARD
PROBLEM TO BE SOLVED: To effectively improve attenuation characteristics of a signal by a simple and inexpensive constitution when performing transmission of a high-frequency signal.SOLUTION: A multilayer wiring board (1) comprises: a land (6) for mounting an electronic component (11), which is arra...
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Main Authors | , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
11.04.2016
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To effectively improve attenuation characteristics of a signal by a simple and inexpensive constitution when performing transmission of a high-frequency signal.SOLUTION: A multilayer wiring board (1) comprises: a land (6) for mounting an electronic component (11), which is arranged on a surface of an insulation layer (3) where a plurality of layers are laminated; and a differential transmission line (2) for signal transmission, which is arranged on a surface or inside the insulation layer (3) and composed of paired two signal lines (2a, 2a) extending from the land (6) toward the receiving side. Each of the signal lines (2a, 2a) of the differential transmission line (2) includes an open stub (7) which extends in the lamination direction of the insulation layer (3) and has a width the same as a width of one of the signal lines (2a, 2a) and has one end which is connected to one of the signal lines (2a, 2a) and the other end which is open.SELECTED DRAWING: Figure 1
【課題】高周波信号の伝送を行うにあたって、簡単で安価な構成で、信号の減衰特性の改善を効果的に図る。【解決手段】多層配線基板(1)は、複数層が積層された絶縁層(3)の表面部に、電子部品(11)が実装されるランド(6)を備えると共に、前記絶縁層(3)の表面部又は内部に、前記ランド(6)から受信側に向けて延びる2本ペアの信号線(2a,2a)からなる信号伝送用の差動伝送線路(2)を備えるものであって、前記差動伝送線路(2)の各信号線(2a,2a)には、前記絶縁層(3)の積層方向に延び、該信号線(2a,2a)の幅寸法と同等の幅寸法を有し、一端が該信号線(2a,2a)に接続され且つ他端が開放されている開放スタブ(7)が夫々設けられている。【選択図】図1 |
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Bibliography: | Application Number: JP20140174167 |