SPINDLE DEVICE AND MACHINE TOOL HAVING SPINDLE DEVICE
PROBLEM TO BE SOLVED: To perform detection of an adhesion condition of a tool adhering to a spindle device, and cleaning by air of an adhering part where the tool adheres to the spindle device, with the respective suitable flow rates of air.SOLUTION: The spindle device includes: a spindle 20 on whic...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
11.04.2016
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To perform detection of an adhesion condition of a tool adhering to a spindle device, and cleaning by air of an adhering part where the tool adheres to the spindle device, with the respective suitable flow rates of air.SOLUTION: The spindle device includes: a spindle 20 on which a tool 100 is to be removably mounted; a rod 30 slidably supported by the spindle 20, for attaching/detaching the tool 100 to/from the spindle 20 by sliding; a fluid flow path 32 formed in the rod 30; fluid supply means 51, 70 for supplying fluid to the fluid flow path 32; fluid flow paths 24 for seating detection formed in the spindle 20 so as to communicate with the fluid flow path 32 when the rod 30 is located at a first position, for detecting a seating condition of the tool 100 seated on the spindle 20; and fluid flow paths 25 for cleaning formed in the spindle 20 so as to communicate with the fluid flow path 32 when the rod 30 is located at a second position different from the first position, for cleaning a seating part where the tool 100 is seated on the spindle 20.SELECTED DRAWING: Figure 1
【課題】主軸装置と工具との密着状態の検出および主軸装置と工具との密着部のエア洗浄をそれぞれ適切なエア流量で行うことができるようにする。【解決手段】工具100を着脱可能に装着する主軸20と、前記主軸20に摺動可能に支持され、摺動動作によって前記工具100を前記主軸20に着脱させるロッド30と、前記ロッド30に形成される流体流路32と、前記流体流路32に流体を供給する流体供給手段51,70と、前記ロッド30が第一の位置に位置した場合に前記流体流路32と連通するように前記主軸20に形成され、前記主軸20と前記工具100との着座状態を検出するための着座検出用流体流路24と、前記ロッド30が前記第一の位置と異なる第二の位置に位置した場合に前記流体流路32と連通するように前記主軸20に形成され、前記主軸20と前記工具100との着座部を洗浄するための洗浄用流体流路25とを備えて成る。【選択図】図1 |
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Bibliography: | Application Number: JP20140175048 |