ELECTRONIC DEVICE

• Main Authors: MASUYAMA YUJI, OGATA KEIZO, HATA TADAYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 04.04.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To obtain an electronic device capable of preventing a short circuit between a stem and a lead terminal.SOLUTION: A stem 1 has a first through-hole 2. A flexible substrate 3 has a second through-hole 4. A lead terminal 5 has a first portion 5a penetrating the first through-hole 2, a second portion 5b penetrating the second through-hole 4, and a third portion 5c arranged between the stem 1 and the flexible substrate 3. Insulating glass 6 fills a gap between the stem 1 and the lead terminal 5 in the first through-hole 2. A wiring pattern 7 is provided on the flexible substrate 3. Solder 8 connects the lead terminal 5 and the wiring pattern 7. The third portion 5c of the lead terminal 5 has a larger lead diameter than the first and second portions 5a and 5b and prevents the solder 8 from flowing out from the flexible substrate 3 side to the stem 1 side.SELECTED DRAWING: Figure 1 【課題】ステムとリード端子のショートを防ぐことができる電子デバイスを得る。【解決手段】ステム１は第１の貫通孔２を有する。フレキシブル基板３は第２の貫通孔４を有する。リード端子５は、第１の貫通孔２を貫通する第１の部分５ａと、第２の貫通孔４を貫通する第２の部分５ｂと、ステム１とフレキシブル基板３の間に配置された第３の部分５ｃとを有する。絶縁性ガラス６は、第１の貫通孔２内においてステム１とリード端子５との間を埋める。配線パターン７がフレキシブル基板３に設けられている。はんだ８がリード端子５と配線パターン７を接続する。リード端子５の第３の部分５ｃは、第１及び第２の部分５ａ，５ｂよりもリード径が大きく、はんだ８がフレキシブル基板３側からステム１側に流れ出すのを防ぐ。【選択図】図１