THERMOSETTING RESIN CURING METHOD AND THERMOSETTING RESIN CURING APPARATUS

• Main Authors: OMIYA TAKENORI, OISHI SATOSHI
• Format: Patent
• Language: English; Japanese
• Published: 31.03.2016
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a thermosetting resin curing method and a thermosetting resin curing apparatus capable of satisfactorily curing a thermosetting resin agent by irradiation with a laser beam.SOLUTION: The thermosetting resin curing method cures a thermosetting resin agent 13 by irradiation with a laser beam L. The laser beam L has a wavelength longer than a wavelength region in which the light absorptivity of the thermosetting resin agent 13 is maximum or a wavelength shorter than the wavelength region and is irradiated on the thermosetting resin agent 13. The intensity of the laser beam L irradiated on the thermosetting resin agent 13 is changed from a first light intensity to a second light intensity lower than the first light intensity.SELECTED DRAWING: Figure 6 【課題】レーザ光の照射によって熱硬化性樹脂剤を良好に硬化させ得る熱硬化性樹脂硬化方法及び熱硬化性樹脂硬化装置を提供する。【解決手段】レーザ光Ｌの照射によって熱硬化性樹脂剤１３を硬化させる熱硬化性樹脂硬化方法であって、レーザ光Ｌは、熱硬化性樹脂剤１３の光吸収率が最高となる波長域よりも長い波長又は波長域よりも短い波長を有しており、熱硬化性樹脂剤１３に照射され、熱硬化性樹脂剤１３に照射されるレーザ光Ｌの強度は、第１の光強度から、第１の光強度よりも低い第２の光強度に変化させられる。【選択図】図６