ELECTROMAGNETIC INDUCTION HEATING TYPE MOLD DEVICE FOR MOLDING AND VULCANIZING RUBBER PACKING

• Main Authors: MASUDA KOJIRO, ISHIKAWA JUNICHIRO
• Format: Patent
• Language: English; Japanese
• Published: 24.03.2016
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a mold device for molding and vulcanizing a rubber packing by which a high-quality packing product can be produced with high productivity without causing heat deformation of a mold body or the molding and vulcanizing apparatuses while achieving energy saving.SOLUTION: A mold device for molding and vulcanizing a rubber packing is composed of: a magnetic metal layer constituting a mold body and also a mold cavity surface, and comprising a nickel alloy or an iron alloy; a mold support layer which is a nonmagnetic or feeble magnetic insulator layer disposed opposite the mold cavity surface of the magnetic metal layer and supports the mold body; and an electromagnetic induction coil disposed in the mold support layer. The device is configured so as to heat the mold body directly and transmit a molding pressure to the mold body via the mold support layer.SELECTED DRAWING: Figure 2 【課題】金型本体や成形・加硫装置の熱変形をなくし、省エネを図り、高品質の製品を高い生産性で製造できるゴムパッキン成形・加硫用金型装置を提供する。【解決手段】金型本体を構成するとともに、金型キャビティ面を構成する、ニッケル合金または鉄合金からなる磁気金属層と、磁気金属層の金型キャビティ面の反対側に配置された非磁性材または弱磁性の絶縁体層であって、金型本体を支持する金型支持層と、金型支持層内に配置された電磁誘導コイルとから構成し、金型本体を直接加熱するとともに、金型支持層を介して成形圧を金型本体に伝えるようにする。【選択図】図２