SUBSTRATE HEATING APPARATUS, SUBSTRATE HEATING METHOD AND STORAGE MEDIUM

• Main Authors: MIZUTA SEITO, TAKAYANAGI YASUHARU, YOSHIDA YUICHI
• Format: Patent
• Language: English; Japanese
• Published: 22.03.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To highly accurately control the displacement volume of each heating module in a substrate heating apparatus which comprises a plurality of heating modules including processing containers for processing substrates and an exhaust path common to each heating module.SOLUTION: A substrate heating apparatus comprises: a plurality of heating modules each of which includes an air inlet for taking gas for purge into a processing atmosphere in a processing container and an air outlet for exhausting the processing atmosphere; individual exhaust paths which are connected to the respective air outlets; a common exhaust path which is connected commonly to a downstream end of each individual exhaust path; a branch path which is provided branching to each individual exhaust path and opens to the outside of the processing container; and a displacement volume adjustment part which adjusts a flow rate of the displacement volume exhausted from an air outlet side to the common exhaust path to a take-in volume taken from the outside of the processing container to the common exhaust path via the branch path. With this configuration, variation in the flow rate of gas from each individual exhaust path to the common exhaust path is suppressed.SELECTED DRAWING: Figure 1 【課題】基板を処理する処理容器を含む複数の加熱モジュールと、各加熱モジュールに共通の排気路と、を備える基板加熱装置において、各加熱モジュールにおける排気量を精度高く制御すること。【解決手段】前記処理容器内の処理雰囲気にパージ用の気体を取り込むための給気口と、処理雰囲気を排気する排気口と、を各々備えた複数の加熱モジュールと、各々の排気口に接続された個別排気路と、各個別排気路の下流端に共通に接続された共通排気路と、各個別排気路に分岐して設けられ、処理容器の外部に開口する分岐路と、前記排気口側から前記共通排気路に排気される排気量と前記処理容器の外部から前記分岐路を介して前記共通排気路に取り込まれる取り込み量との流量比を調整するための排気量調整部と、を備えるように装置を構成する。それによって各個別排気路から共通排気路への気体の流量の変動を抑える。【選択図】図１