ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To inhibit deformation of a microphone cap in an assembly process of an electronic apparatus.SOLUTION: An electronic apparatus includes: a first housing; a circuit board housed in the first housing and on which a microphone is installed; a microphone cap having a cylindrical pa...

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Bibliographic Details
Main Authors TODOROKI HIROKAZU, TOKAWA WATARU, KAWAGUCHI NORIAKI, FUKUHARA MASAHIRO, YADA HARUYOSHI
Format Patent
LanguageEnglish
Japanese
Published 07.03.2016
Subjects
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
TELEPHONIC COMMUNICATION
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Summary:PROBLEM TO BE SOLVED: To inhibit deformation of a microphone cap in an assembly process of an electronic apparatus.SOLUTION: An electronic apparatus includes: a first housing; a circuit board housed in the first housing and on which a microphone is installed; a microphone cap having a cylindrical part and a bottom plate part which has hardness higher than the cylindrical part, forms a bottom surface of the cylindrical part, has an opening part, and is integrally molded with the cylindrical part, the microphone cap attached to the microphone in a state where the microphone is installed on the circuit board; and a second housing which presses the microphone cap and is fixed to the first housing with the microphone cap attached to the microphone.SELECTED DRAWING: Figure 4 【課題】電子機器の組み立て工程におけるマイクキャップの変形を抑制することを課題とする。【解決手段】電子機器は、第一の筐体と、前記第一の筐体に収容され、マイクが設置された回路基板と、筒状部と、前記筒状部より硬度が高くかつ前記筒状部の底面を形成するとともに開口部を有し前記筒状部と一体成形された底板部と、を有するとともに、前記回路基板に前記マイクが設置されている状態で前記マイクに装着されたマイクキャップと、前記マイクに前記マイクキャップが装着されている状態で、前記マイクキャップを押圧して前記第一の筐体に固定された第二の筐体と、を備える。【選択図】図４
Bibliography:Application Number: JP20140154232