SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To enhance cooling performance while simplifying the insulation configuration of heating components between adjoining units, in a semiconductor module through which refrigerant flows, of a laminate laminating a plurality of units integrating the heating component and a cooling...

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Bibliographic Details
Main Authors ASAE KOJI, OBARA KIMIKAZU, SAKIMICHI TORU, MATSUI HIROHITO
Format Patent
LanguageEnglish
Japanese
Published 07.03.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To enhance cooling performance while simplifying the insulation configuration of heating components between adjoining units, in a semiconductor module through which refrigerant flows, of a laminate laminating a plurality of units integrating the heating component and a cooling fin by a mold resin part.SOLUTION: In each individual unit 1, a heating component 10 and cooling fins 20, 30 are jointed mechanically and electrically by metal junction, and between adjoining units 1, an electrically insulating plate 50 is provided between the exposed surface 32 of cooling fin 30 in one unit 1 and the exposed surface 22 of cooling fin 20 in the other unit facing each other, and the refrigerant has electrical insulation.SELECTED DRAWING: Figure 2 【課題】発熱部品および冷却フィンをモールド樹脂部で一体化したユニットを、複数個積層してなる積層体であって、内部に冷媒が流れる半導体モジュールにおいて、隣り合うユニット間の発熱部品同士の絶縁構成の簡素化を図りつつ、冷却性能を向上させる。【解決手段】個々のユニット１において、発熱部品１０と冷却フィン２０、３０とは金属接合により機械的および電気的に接合されており、隣り合うユニット１間にて、一方のユニット１における冷却フィン３０の露出面３２と他方のユニット１における冷却フィン２０の露出面２２との対向間には、電気絶縁性の絶縁板５０が設けられており、冷媒は、電気絶縁性を有するものである。【選択図】図２
Bibliography:Application Number: JP20140152980