DEVELOPING METHOD, DEVELOPING DEVICE, AND COMPUTER-READABLE RECORDING MEDIUM
PROBLEM TO BE SOLVED: To improve uniformity of an in-plane line width distribution.SOLUTION: A developing method is provided, which comprises developing a resist film R disposed on a surface Wa of a wafer W and exposed to form a resist pattern. The method includes: a step in which, while rotating th...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
07.03.2016
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To improve uniformity of an in-plane line width distribution.SOLUTION: A developing method is provided, which comprises developing a resist film R disposed on a surface Wa of a wafer W and exposed to form a resist pattern. The method includes: a step in which, while rotating the wafer W around a rotation axis extending in a direction orthogonal to the surface Wa of the wafer W that is horizontally held, a developer L is discharged from a discharge port Na of a liquid contact member N located above the wafer W onto the resist film R so as to spread the developer L on the surface of the resist film R; and a step in which the liquid contact member N having a lower end face Nb opposing to the surface Wa of the wafer W is disposed above an advance region in the surface Wa of the wafer W, where supply of the developer L from the liquid contact member N is carried out earlier.SELECTED DRAWING: Figure 8
【課題】面内線幅分布の均一性を向上させる。【解決手段】現像方法は、ウエハWの表面Wa上に配置され且つ露光されたレジスト膜Rを現像してレジストパターンを形成する現像方法であって、水平に保持されたウエハWの表面Waに直交する方向に延びている回転軸の周りにウエハWを回転させつつ、ウエハWの上方に位置する接液部材Nの吐出口Naから現像液Lをレジスト膜R上に吐出して、レジスト膜Rの表面上に現像液Lを行き渡らせる工程と、ウエハWの表面Waと対向する下端面Nbを有する接液部材Nを、ウエハWの表面Waのうち接液部材Nからの現像液Lの供給が先行した領域である先行領域の上方に配置する工程とを含む。【選択図】図8 |
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Bibliography: | Application Number: JP20140152123 |