CONDUCTIVE FINE PARTICLE, ANISOTROPY CONDUCTIVE MATERIAL, AND CONDUCTIVE CONNECTION STRUCTURE

• Main Authors: ISHIDA HIROYA, MATSUSHITA KIYOTO
• Format: Patent
• Language: English; Japanese
• Published: 07.03.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; CONDUCTORS; CURRENT COLLECTORS; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; INSULATORS; LINE CONNECTORS; METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a conductive fine particle that allows electrical connection with high reliability and enables a conductive connection structure to be produced in high yield, and provide an anisotropic conductive material comprising the conductive fine particle, and a conductive connection structure connected with the conductive fine particle or the anisotropic conductive material.SOLUTION: A conductive fine particle has a base fine particle, and a solder layer formed on the surface of the base fine particle, wherein the content of gas components measured under the conditions of heating samples up to 300°C by thermodesorption GC-MS method is 5 ppm or less.SELECTED DRAWING: None 【課題】信頼性が高い電気接続ができ、高い歩留まりで導電接続構造体を製造できる導電性微粒子を提供する。また、該導電性微粒子を含有する異方性導電材料、及び、該導電性微粒子又は該異方性導電材料によって接続された導電接続構造体を提供する。【解決手段】基材微粒子と、前記基材微粒子の表面に形成されたハンダ層とを有する導電性微粒子であって、熱脱着ＧＣ−ＭＳ法により試料を３００℃にまで加熱する条件にて測定したガス成分の含有量が５ｐｐｍ以下である導電性微粒子。【選択図】 なし