CURABLE COMPOSITION COMPRISING EPISULFIDE COMPOUND AND CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING THE SAME

• Main Authors: OCHI KOICHI, MIYAUCHI SHINSUKE, YASUDA YUICHIRO
• Format: Patent
• Language: English; Japanese
• Published: 03.03.2016
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a curable composition wherein, even when the curable component comprises an episulfide compound with a fluorene skeleton, the curable composition has a high gel fraction and the cured product has a high strength.SOLUTION: A curable composition is prepared by combining a curable component comprising an episulfide compound represented by the formula (1) with an amine-based curing agent at such a ratio that a molar ratio of thioepoxy groups/amino groups becomes 100/0.1-100/65 (where ring Z represents an aromatic hydrocarbon ring, Rrepresents a substituent, Rrepresents an alkylene group, Rrepresents a substituent, k is an integer of 0-4, m is an integer of 1 or more, n is an integer of 0 or more).SELECTED DRAWING: None 【課題】硬化性成分がフルオレン骨格を有するエピスルフィド化合物であっても、ゲル分率が高く、硬化物の強度が大きい硬化性組成物を提供する。【解決手段】下記式（１）で表されるエピスルフィド化合物を含む硬化性成分とアミン系硬化剤とを、モル比がチオエポキシ基／アミノ基＝１００／０．１〜１００／６５となる割合で組み合わせて硬化性組成物を調製する。（式中、環Ｚは芳香族炭化水素環、Ｒ１は置換基、Ｒ２はアルキレン基、Ｒ３は置換基を示し、ｋは０〜４の整数、ｍは１以上の整数、ｎは０以上の整数である）【選択図】なし