FILM DEPOSITION METHOD, FILM DEPOSITION APPARATUS, AND STRUCTURE

• Main Authors: FUCHIDA HIDETSUGU, OZAWA HIDEKAZU, TOKIZAKI EIJI
• Format: Patent
• Language: English; Japanese
• Published: 18.02.2016
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a film deposition method and apparatus capable of depositing an insulating film having high dielectric voltage even in a thin film state by increasing the denseness and adhesiveness of a formed film.SOLUTION: In a film deposition method, gas is introduced into a clos...