CUTTING DEVICE, CUTTING METHOD, AND DISASSEMBLY SYSTEM USING CUTTING DEVICE

• Main Authors: KUROSAWA KOICHI, OMORI SHINYA, MORINAKA TADASHI, ISHIZUKA IPPEI
• Format: Patent
• Language: English; Japanese
• Published: 08.02.2016
• Subjects: BROACHING; DECONTAMINATION ARRANGEMENTS THEREFOR; FILING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; NUCLEAR ENGINEERING; NUCLEAR PHYSICS; PERFORMING OPERATIONS; PHYSICS; PLANING; PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULARRADIATION OR PARTICLE BOMBARDMENT; SAWING; SCRAPING; SHEARING; SLOTTING; TRANSPORTING; TREATING RADIOACTIVELY CONTAMINATED MATERIAL

PROBLEM TO BE SOLVED: To provide a cutting device capable of efficiently performing cutting in a short time, a cutting method, and a disassembly system using the cutting device.SOLUTION: A cutting device has: a laser head for irradiating a construction object with laser beam to soften the construction object; and a cutting part including a blade for cutting the softened construction object, and driving means for hydraulically driving the blade. The blade has a cooling channel inside through which cooling water is circulated.SELECTED DRAWING: Figure 5 【課題】本発明は、効率よく短時間で切断できる切断装置及び切断方法並びに切断装置を用いた解体システムを提供する。【解決手段】本発明は、施工対象物にレーザ光を照射し、施工対象物を軟化させるレーザヘッドと、軟化した施工対象物を切断するブレードと、ブレードを水圧駆動する駆動手段とを備える切断部と、を有することを特徴とする。また、本発明は、前記ブレードは内部に冷却水が通る冷却流路を有することを特徴とする。【選択図】図５