ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide an electronic device which achieves improvement of the yield or to provide an electronic device which prevents a sealing resin from peeling from a sub-electrode.SOLUTION: An electronic device includes: an electronic element 1; and a wire 3 bonded to the electronic el...

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Bibliographic Details
Main Authors FUJII KENJI, KAGEYAMA SATOSHI
Format Patent
LanguageEnglish
Japanese
Published 01.02.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an electronic device which achieves improvement of the yield or to provide an electronic device which prevents a sealing resin from peeling from a sub-electrode.SOLUTION: An electronic device includes: an electronic element 1; and a wire 3 bonded to the electronic element 1. The electronic element 1 includes a bonding pad in which the wire 3 is bonded. The bonding pad includes a Pd layer 21 and the Pd layer 21 directly contacts with the wire 3.SELECTED DRAWING: Figure 25 【課題】 歩留まりの向上を図ることができる電子装置を提供すること、あるいは、封止樹脂が副電極から剥離することを防止できる電子装置を提供すること。【解決手段】 電子素子１と、電子素子１にボンディングされたワイヤ３と、を備え、電子素子１は、ワイヤ３がボンディングされたボンディングパッドを含み、ボンディングパッドは、Ｐｄ層２１を含み、Ｐｄ層２１は、ワイヤ３に直接接している。【選択図】 図２５
Bibliography:Application Number: JP20140143164