WIRING BOARD, ELECTRIC MOTOR, ELECTRIC APPARATUS AND AIR CONDITIONER

• Main Authors: URABE YUTO, YAMAMOTO MINEO, SAKANOBE KAZUNORI, ISHII HIROYUKI, OYA JUNICHIRO, ASO HIROKI
• Format: Patent
• Language: English; Japanese
• Published: 01.02.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; DYNAMO-ELECTRIC MACHINES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a wiring board capable of suppressing positional deviation of mounting at the time of reflow furnace heating, without impairing the solder strength.SOLUTION: A wiring board for mounting an electronic component (IC body) having a plurality of pins includes a plurality of footprints to which the plurality of pins are soldered by reflow, and a base board having a surface on which a plurality of footprints are formed. The footprint 22 has a shape including a missing part of a rectangle. Since a part of the missing part exists in a positional deviation allowable region, where the bottom face of a pin 21 is expanded uniformly and omni-directionally on the wiring board surface in a range smaller than the mounting position accuracy, the bottom face of a pin 21 is confined in the positional deviation allowable region.SELECTED DRAWING: Figure 7 【課題】半田強度を損なうことなく、リフロー炉加熱時の実装の位置ズレを高い位置精度で抑制することができる配線板を得ること。【解決手段】複数のピンを有する電子部品（ＩＣ本体）が実装される配線板であって、複数のピンがリフローにより半田付けされる複数のフットプリントと、表面に複数のフットプリントが形成されるベース基板と、を備え、フットプリント２２は、矩形の一部が欠けた欠落部を含む形状であり、欠落部の一部が、ピン２１の底面を実装位置精度よりも小さい範囲で配線板面上の全方向に均しく拡大した位置ズレ許容領域内に存在することで、ピン２１の底面が位置ズレ許容領域内に収まる配線板とする。【選択図】図７