THERMOSETTING RESIN COMPOSITION FOR LAMINATE, PREPREG USING THE SAME, LAMINATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MULTILAYER PRINTED CIRCUIT BOARD

• Main Authors: FUKUI MASATO, SOTOZAKI YUKIMASA, AKIYAMA MASANORI
• Format: Patent
• Language: English; Japanese
• Published: 01.02.2016
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

PROBLEM TO BE SOLVED: To provide: a thermosetting resin composition for laminate, which can decrease an amount of powder generated after punching fabrication of a printed circuit board; a prepreg using the same; a laminate for a printed circuit board; and a multilayer printed circuit board.SOLUTION:...