THERMOSETTING RESIN COMPOSITION FOR LAMINATE, PREPREG USING THE SAME, LAMINATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MULTILAYER PRINTED CIRCUIT BOARD

• Main Authors: FUKUI MASATO, SOTOZAKI YUKIMASA, AKIYAMA MASANORI
• Format: Patent
• Language: English; Japanese
• Published: 01.02.2016
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

PROBLEM TO BE SOLVED: To provide: a thermosetting resin composition for laminate, which can decrease an amount of powder generated after punching fabrication of a printed circuit board; a prepreg using the same; a laminate for a printed circuit board; and a multilayer printed circuit board.SOLUTION: A thermosetting resin composition for laminate comprises (A) a thermosetting resin having a dihydrobenzoxazine ring, (B) a polycondensate of phenols, a compound having a triazine ring, and aldehydes, (C) a phenol novolac-type epoxy resin, (D) a condensed phosphate-type flame retardant, (E) a phenoxy resin, and (F) an inorganic filler. The total amount of the thermosetting resin composition for laminate comprises 20 to 40 mass% of (A), 10 to 30 mass% of (B), 20 to 40 mass% of (C), 5 to 35 mass% of (D), and 1 to 15 mass% of (E); and relative to a total of 100 pts.mass of (A) to (E), 10 to 100 pts.mass of the (F) inorganic filler is contained.SELECTED DRAWING: None 【課題】 プリント配線板の打抜加工後の粉落ち量を低減できることができる積層板用熱硬化性樹脂組成物、およびそれを用いたプリプレグ、プリント配線板用積層板、並びに多層プリント配線板を提供する。【解決手段】 （Ａ）ジヒドロベンゾオキサジン環を有する熱硬化性樹脂と、（Ｂ）フェノール類とトリアジン環を有する化合物とアルデヒド類の縮重合物と、（Ｃ）フェノールノボラック型エポキシ樹脂と、（Ｄ）縮合リン酸エステル系難燃剤と、（Ｅ）フェノキシ樹脂と、（Ｆ）無機充填剤とを含む積層板用熱硬化性樹脂組成物であって、前記積層板用熱硬化性樹脂組成物の総量中に、（Ａ）２０〜４０質量％、（Ｂ）１０〜３０質量％、（Ｃ）２０〜４０質量％、（Ｄ）５〜３５質量％、（Ｅ）１〜１５質量％を含み、（Ａ）〜（Ｅ）の総量１００質量部に対して、（Ｆ）無機充填剤を１０〜１００質量部含む積層板用熱硬化性樹脂組成物。【選択図】 なし