THERMAL AIR FLOW METER

PROBLEM TO BE SOLVED: To improve the measuring accuracy of a thermal air flow meter.SOLUTION: To attain the object, a thermal air flow meter of the present invention is configured so that the sensor chip and the plate are molded with resin so as to expose part of a diaphragm of the sensor chip and t...

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Bibliographic Details
Main Authors OGATA KIMITOSHI, ISHIZUKA NORIO, TOKUYASU NOBORU, TASHIRO SHINOBU
Format Patent
LanguageEnglish
Japanese
Published 21.01.2016
Subjects
MEASURING
MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL
METERING BY VOLUME
PHYSICS
TESTING
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Summary:PROBLEM TO BE SOLVED: To improve the measuring accuracy of a thermal air flow meter.SOLUTION: To attain the object, a thermal air flow meter of the present invention is configured so that the sensor chip and the plate are molded with resin so as to expose part of a diaphragm of the sensor chip and the plate, and the plate includes a groove or a partially thinned portion outside of a sensor chip mounting region in which the plate receives a pushing load from the sensor chip during the molding. 【課題】熱式空気流量計の計測精度を向上させることを目的とする。【解決手段】上記目的を達成するために、本発明の熱式空気流量計は、前記センサチップ及び前記プレートは、前記センサチップのダイアフラム及び前記プレートの一部が露出するように樹脂でモールドされ、前記プレートは、前記モールド時に前記プレートが前記センサチップから押し荷重を受ける前記センサチップ搭載面領域の外部に溝、あるいは、一部薄くなる減肉部を有することを特徴とする。【選択図】 図１
Bibliography:Application Number: JP20140133497