SUBSTRATE PROCESSING METHOD, STORAGE MEDIUM AND SUBSTRATE PROCESSING APPARATUS

• Main Authors: NIMATA TAKESUKE, SHIOKAWA TOSHIYUKI, HIRAYAMA TSUKASA, PETER D'ELIA
• Format: Patent
• Language: English; Japanese
• Published: 18.01.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a batch type substrate processing device in which a discharge port for dry promoting gas can be located at the position corresponding to the gap between back surfaces of substrates irrespective of change of an arrangement pattern of the substrates.SOLUTION: The relative positional relationship regarding the substrate arrangement direction of substrates between plural substrates held by a substrate holding tool and plural discharge ports of a nozzle for discharging dry promoting gas such as IPA vapor or the like can be adjusted. When the substrates are arranged in a first arrangement pattern in which the surfaces of even-numbered substrates face a first direction and the surfaces of odd-numbered substrates face a second direction, and when the substrates are arranged in a second arrangement pattern in which the surfaces of the even-numbered substrates face the second direction and the surfaces of the odd-numbered substrates face the first direction, the adjustment is performed by displacing the position of the substrate holding member during delivery of a substrate from the substrate holding member (22a) of a substrate feeding device (22) to the substrate holding tool (124) by only the displacement corresponding to the arrangement pitch of the substrate in the arrangement direction of the substrate (W). 【課題】バッチ式基板処理装置にて、基板の配列パターンの変更に関わらず、乾燥促進ガスの吐出口を基板の裏面間の隙間に対応する位置に位置させる。【解決手段】基板保持具により保持された複数の基板と、ＩＰＡ蒸気等の乾燥促進ガスを吐出するノズルの複数の吐出口との、基板の配列方向に関する相対的位置関係が調整可能である。一実施形態において、調整は、偶数番目の基板の表面が第１方向を向き奇数番目の基板の表面が第２方向を向く第１配列パターンで基板が配列されているときと、偶数番目の基板の表面が第２方向を向き奇数番目の基板の表面が第１方向を向く第２配列パターンで基板が配列されているときとで、基板搬送装置（２２）の基板保持部材（２２ａ）から基板保持具（１２４）に基板を渡すときの基板保持部材の位置を、基板（Ｗ）の配列方向に基板の配列ピッチに相当する距離だけずらすことにより行われる。【選択図】図７