SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device that has a light-receiving layer including a distortion compensation layer that can sufficiently suppress generation of lattice relaxation while maintaining a good surface quality.SOLUTION: An infrared light receiving element 1 that is a semico...

Full description

Saved in:
Bibliographic Details
Main Authors AKITA KATSUSHI, KYONO TAKASHI, ARIKATA SUGURU
Format Patent
LanguageEnglish
Japanese
Published 18.01.2016
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device that has a light-receiving layer including a distortion compensation layer that can sufficiently suppress generation of lattice relaxation while maintaining a good surface quality.SOLUTION: An infrared light receiving element 1 that is a semiconductor device comprises: a substrate; a buffer layer formed of GaSb; and a light-receiving layer including a multiquantum well structure. The multiquantum well structure is configured by repeating a unit structure 41 consisting of a plurality of element layers a plurality of times. The unit structure 41 includes a first element layer 71 formed of InAsSb, a second element layer 72 formed of GaSb, and a third element layer 73 formed of InSbAs. The third element layer 73 is arranged so as to be contacted with one principal surface 72A of the second element layer 72. The other principal surface 72B of the second element layer 72 is contacted with the first element layer 71 in the unit structure 41. A value of a is 0 or more and 0.05 or less, and a value of x is greater than 0 and less than 1, and a thickness of the third element layer 73 is 0.1 nm or more and 0.9 nm or less. 【課題】良好な表面性状を維持しつつ格子緩和の発生を十分に抑制可能な歪み補償層を含む受光層を備えた半導体装置を提供する。【解決手段】半導体装置である赤外線受光素子1は基板と、GaSbからなるバッファ層と、多重量子井戸構造を含む受光層と、を備える。多重量子井戸構造は、複数の要素層からなる単位構造41が複数回繰り返されて構成される。単位構造41は、InAs1−aSbaからなる第1要素層71と、GaSbからなる第2要素層72と、InSbxAs1−xからなる第3要素層73と、を含む。第3要素層73は第2要素層72の一方の主面72Aに接触するように配置される。第2要素層72の他方の主面72Bは、この単位構造41内の第1要素層71に接触する。上記aの値は0以上0.05以下、上記xの値は0を超え1未満、第3要素層73の厚みは0.1nm以上0.9nm以下である。【選択図】図2
Bibliography:Application Number: JP20140128287