CURABLE RESIN COMPOSITION, COMPOSITION FOR FORMING PERMANENT COATING FILM, DRY FILM, AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a curable resin composition, a composition for forming a permanent coating film, a dry film, and a printed wiring board, excellent in various characteristics such as electric insulating property, adhesiveness, heat resistance, crack resistance, and gold plating resis...

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Bibliographic Details
Main Authors KONDO SHINOBU, MITANI TAKESHI, FUKUDA SHINICHIRO, HARIMA EIJI
Format Patent
LanguageEnglish
Japanese
Published 18.01.2016
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Summary:PROBLEM TO BE SOLVED: To provide a curable resin composition, a composition for forming a permanent coating film, a dry film, and a printed wiring board, excellent in various characteristics such as electric insulating property, adhesiveness, heat resistance, crack resistance, and gold plating resistance and excellent in electric insulating property and adhesiveness even in a severe environment with a high temperature, a high humidity or the like.SOLUTION: The curable resin composition comprises (A) a carboxyl group-containing resin, (B) an inorganic filler, (C) a thermosetting component, and (D) a compound having a urethane bond. The (A) carboxyl group-containing resin contains a carboxyl group-containing resin having a novolac skeleton; and the (C) thermosetting component contains a maleimide compound. 【課題】電気絶縁性、密着性、耐熱性、クラック耐性、金メッキ耐性等の諸特性に優れ、さらに高温、高湿等の厳しい環境下での電気絶縁性、密着性においても優れた硬化性樹脂組成物、永久被膜形成用組成物、ドライフィルムおよびプリント配線板を提供すること。【解決手段】A)カルボキシル基含有樹脂、(B)無機充填剤、(C)熱硬化成分、及び(D)ウレタン結合を有する化合物を含む硬化性樹脂組成物であって、前記(A)カルボキシル基含有樹脂が、ノボラック骨格を有するカルボキシル基含有樹脂を含み、前記(C)熱硬化成分が、マレイミド化合物を含むことを特徴とする硬化性樹脂組成物。【選択図】なし
Bibliography:Application Number: JP20140130053