LED LIGHTING DEVICE

• Main Authors: MAEDA TSUTOMU, TANJI HIROYUKI
• Format: Patent
• Language: English; Japanese
• Published: 14.01.2016
• Subjects: BLASTING; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS; LIGHTING; MECHANICAL ENGINEERING; NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; NON-PORTABLE LIGHTING DEVICES; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS; WEAPONS

PROBLEM TO BE SOLVED: To provide an LED lighting device which can be directly mounted on a ceiling surface, which secures a sufficient heat radiation effect while reducing time and effort and cost in manufacturing with a simple structure, which improves luminous efficiency of an LED element, and which radiates light evenly.SOLUTION: An LED lighting device includes: a device body 1 mounted on a mounted surface; and a light emitting unit mounted on the device body 1. The light emitting unit has: a heat radiation plate 23 in which an LED substrate 24 on which an LED element 26 is mounted and a power supply circuit 28 are disposed; and a translucent cover 21 for covering the LED substrate 24. The power supply circuit 28 is disposed on the heat radiation plate 23 by providing a space with itself and the heat radiation plate 23 by a power base 23b which mounts the power supply circuit 28 with an interval at an upper part of a substrate part 23a for fixing the LED substrate 24 provided at the heat radiation plate 23. The translucent cover 21 is mounted via a cover insertion part 23c provided at the heat radiation plate 23. Also, the power supply circuit 28 and the translucent cover 21 are disposed by sandwiching a part of the heat radiation plate 23. 【課題】天井面に直接取付けることができ、簡易な構造で製造の手間とコストを低減しつつ、充分な放熱効果を確保して、ＬＥＤ素子の発光効率を向上させ、光を均一に照射する。【解決手段】ＬＥＤ照明装置は、被取付面に取り付けられる器具本体１と、器具本体１に装着される発光ユニットとを備えている。発光ユニットは、ＬＥＤ素子２６が実装されたＬＥＤ基板２４と、電源回路２８とを配設した放熱板２３と、ＬＥＤ基板２４を覆う透光性カバー２１を有する。この電源回路２８は、放熱板２３に設けられたＬＥＤ基板２４を固定する基板部２３ａの上方に間隔を隔てて電源回路２８を搭載する電源台２３ｂにより、放熱板２３との間に空間を設けて放熱板２３に配設され、透光性カバー２１は、放熱板２３に設けられたカバー挿入部２３ｃを介して、取り付けられている。また、電源回路２８と透光性カバー２１は、放熱板２３の一部を挟んで配されている。【選択図】図３