GAS BARRIER FILM, FILM SUBSTRATE WITH GAS BARRIER FILM, AND ELECTRONIC DEVICE WITH THE GAS BARRIER FILM

• Main Authors: OKUMOTO KENJI, SHIBATA MASAOMI, SAKAMOTO GOSUKE
• Format: Patent
• Language: English; Japanese
• Published: 14.01.2016
• Subjects: ADVERTISING; BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; CRYPTOGRAPHY; DIFFUSION TREATMENT OF METALLIC MATERIAL; DISPLAY; DISPLAYING; EDUCATION; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; LABELS OR NAME-PLATES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; PERFORMING OPERATIONS; PHYSICS; SEALS; SEMICONDUCTOR DEVICES; SIGNS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a gas barrier film capable of achieving high gas barrier properties and high bending resistance.SOLUTION: A gas barrier film 10 has a multilayer structure where a first barrier layer 11 made of a first inorganic material and a second barrier material 12 made of a second inorganic material different from the first inorganic material are alternately laminated. The multilayer structure includes two or more first barrier layers 11. The first inorganic material is aluminum oxide. Each first barrier layer 11 has a film thickness of 3 nm or more, and the total film thickness of the first barrier layers 11 is 20 nm or less. Both the first barrier layer and the second barrier layer are formed using an atomic layer deposition method. 【課題】高いガスバリア性および高い曲げ耐性を実現可能なガスバリア膜を提供する。【解決手段】ガスバリア膜１０は、第１の無機材料からなる第１のバリア層１１と第１の無機材料とは異なる第２の無機材料からなる第２のバリア層１２とが交互に積層された多層構造を備える。多層構造は、第１のバリア層１１を２層以上有する。第１の無機材料は、酸化アルミニウムである。第１のバリア層１１は、それぞれ３ｎｍ以上の膜厚を有し、第１のバリア層１１の総膜厚が、２０ｎｍ以下であり、第１のバリア層および第２のバリア層が、何れも原子層堆積法を用いて形成されている。【選択図】図１