POWER MODULE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a power module that has a simple structure, and whose manufacturing process is simplified, and that can increase current, and to provide a method of manufacturing the same.SOLUTION: A power module 100 comprises: a ceramic substrate 9; a source electrode pattern 6, a...

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Bibliographic Details
Main Author YOSHIHARA KATSUHIKO
Format Patent
LanguageEnglish
Japanese
Published 12.01.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a power module that has a simple structure, and whose manufacturing process is simplified, and that can increase current, and to provide a method of manufacturing the same.SOLUTION: A power module 100 comprises: a ceramic substrate 9; a source electrode pattern 6, a drain electrode pattern 5, a source signal electrode pattern 7 and a gate signal electrode pattern 8 that are arranged on the ceramic substrate; a semiconductor device 1 disposed on the drain electrode pattern, and that has a source pad electrode 3 and a gate pad electrode 2 on a front side; a source division lead frame 20 bonded with the source electrode pattern and the source pad electrode; and a gate pad electrode division lead frame 22 bonded with the gate pad electrode. 【課題】構造が簡単で、製造プロセスが簡略化され、大電流化可能なパワーモジュールおよびその製造方法を提供する。【解決手段】パワーモジュール１００は、セラミックス基板９と、セラミックス基板上に配置されたソース電極パターン６、ドレイン電極パターン５、ソース信号電極パターン７およびゲート信号電極パターン８と、ドレイン電極パターン上に配置され、表面側にソースパッド電極３およびゲートパッド電極２を有する半導体デバイス１と、ソース電極パターンおよびソースパッド電極に接合されたソース用分割リードフレーム２０と、ゲートパッド電極と接合されたゲートパッド電極用分割リードフレーム２２とを備える。【選択図】図４
Bibliography:Application Number: JP20140122054