RESIN FILM PROCESSING DEVICE

• Main Authors: SUDO FUMIHIKO, MIZOZOE TAKAAKI, EZAKI MAKOTO
• Format: Patent
• Language: English; Japanese
• Published: 07.01.2016
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a resin film processing device which stably forms holes in a resin film.SOLUTION: A resin film processing device includes: conveyance means which conveys a resin film having a long shape along a longitudinal direction of the resin film; hole formation means which radiates laser light to a middle portion of the resin film conveyed by the conveyance means and thereby forms a hole in each radiated portion; and control means which controls the conveyance means and the hole formation means. The control means includes: an input part which inputs a hole size set as a target value; an operation part which changes at least one radiation condition of radiation time of the laser light and radiation intensity of the laser light on the basis of the target value input by the input part; and an output part which outputs the radiation condition changed by the operation part to the hole formation means. 【課題】樹脂フィルムに孔を安定して形成することができる樹脂フィルム加工装置を提供すること。【解決手段】樹脂フィルム加工装置は、長尺状をなす樹脂フィルムをその長手方向に沿って搬送する搬送手段と、搬送手段によって搬送されている途中の樹脂フィルムに対してレーザ光を照射することにより、その照射された部分に孔を形成する孔形成手段と、搬送手段および孔形成手段をそれぞれ制御する制御手段と備える。制御手段は、目標値としての孔の大きさを入力する入力部と、入力部に入力された目標値に基づいて、レーザ光の照射時間、レーザ光の照射強度のうちの少なくとも１つの照射条件を変更する演算部と、演算部で変更された照射条件を孔形成手段に出力する出力部とを有する。【選択図】図７