RESIN FILM PROCESSING DEVICE AND RESIN FILM PROCESSING METHOD

• Main Authors: SUDO FUMIHIKO, MIZOZOE TAKAAKI, EZAKI MAKOTO
• Format: Patent
• Language: English; Japanese
• Published: 07.01.2016
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a resin film processing device which stably forms holes in a resin film, and to provide a resin film processing method.SOLUTION: A resin film processing device includes: conveyance means which conveys a resin film 20 having a long shape along a longitudinal direction of the resin film 20; hole formation means which radiates laser light to a middle portion of the resin film 20 conveyed by the conveyance means and thereby forms a hole 201 in each radiated portion; and radiation condition change means which changes a radiation condition of the laser light in the hole formation means according to a conveyance velocity v of the resin film 20 when one hole 201 is formed in the resin film 20. 【課題】樹脂フィルムに孔を安定して形成することができる樹脂フィルム加工装置および樹脂フィルムの加工方法を提供すること。【解決手段】樹脂フィルム加工装置は、長尺状をなす樹脂フィルム２０をその長手方向に沿って搬送する搬送手段と、搬送手段によって搬送されている途中の樹脂フィルム２０に対してレーザ光を照射することにより、その照射された部分に孔２０１を形成する孔形成手段と、樹脂フィルム２０に対して１つの孔２０１を形成する際に、樹脂フィルム２０の搬送速度ｖに応じて、孔形成手段でのレーザ光の照射条件を変更する照射条件変更手段とを備える。【選択図】図８