SUBSTRATE PROCESSING TOOL

PROBLEM TO BE SOLVED: To provide a substrate processing tool suppressing the down time of a substrate processing tool to the minimum, and suppressing substrate particle pollution to the minimum.SOLUTION: The substrate processing tool includes: a frame which forms at least one chamber capable of isol...

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Main Authors ALEXANDER KRUPYSHEV, MARTIN R ELLIOT, JOSEPH HALLISEY, CHRISTOPHER HOFMEISTER, CRAIG J CARBONE, BLAHNIK JEFFREY C, JOSEPH A KRAUS, WILLIAM FOSNIGHT, FONG HI YIN OWEN
Format Patent
LanguageEnglish
Japanese
Published 24.12.2015
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Summary:PROBLEM TO BE SOLVED: To provide a substrate processing tool suppressing the down time of a substrate processing tool to the minimum, and suppressing substrate particle pollution to the minimum.SOLUTION: The substrate processing tool includes: a frame which forms at least one chamber capable of isolation to retain a controlled atmosphere; at least two substrate support bodies (support shelves) 22A, 22B which are positioned in the at least one of respective chambers 14A, 14B capable of isolation in vertical lamination, and configured to support each substrate; and a cooling unit which are communicably coupled with the at least two substrate support bodies, and configured to supply, along with the at least two substrate support bodies, simultaneous conduction cooling to each substrate positioned on the at least two substrate support bodies. 【課題】基板処理ツールのダウンタイムを最小限に抑えること、及び基板のパーティクル汚染を最小限に抑える基板処理ツールを提供する。【解決手段】基板処理ツールは、制御された雰囲気を保持するために少なくとも1つの隔離可能なチャンバを形成するフレームと、少なくとも1つの隔離可能なチャンバ14A,14Bのそれぞれに位置する少なくとも2つの基板支持体(支持棚)22A,22Bであって、互いに上下に積層され、それぞれの基板を支えるために構成されている、少なくとも2つの基板支持体と、少なくとも2つの基板支持体と連通可能に結合している冷却ユニットである。少なくとも2つの基板支持体及び冷却ユニットが、少なくとも2つの基板支持体上に位置する各基板のそれぞれに同時伝導冷却を与えるように構成されている、冷却ユニットと、を有する。【選択図】図4A
Bibliography:Application Number: JP20150125256